Design, test, integration and packaging of MEMS/MOEMS 2003
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Design, test, integration and packaging of MEMS/MOEMS 2003 DTIP 2003 : 5-7 May, 2003, Cannes, France

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Published by IEEE in Piscataway, N.J .
Written in English

Subjects:

  • Microelectromechanical systems -- Congresses.,
  • Optoelectronic devices -- Congresses.,
  • Micromachining -- Congresses.,
  • Microelectronic packaging -- Congresses.

Book details:

Edition Notes

Other titlesDTIP 2003
StatementKeren Bergman ... [et al.] chairs/editors ; sponsored by CNRS-INPG-UJF ... [et al.].
GenreCongresses.
ContributionsBergman, Keren., Centre national de la recherche scientifique (France), Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (5th : 2003 : Cannes, France)
Classifications
LC ClassificationsTK7874 .D4756 2003
The Physical Object
Paginationxi, 411 p. :
Number of Pages411
ID Numbers
Open LibraryOL3325737M
ISBN 10078037066X
LC Control Number2004299331
OCLC/WorldCa54381468

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The testable design and test of a software-controllable lab-on-a-chip, including a fluidic array of FlowFETs, control and interface electronics is presented. Test hardware is included for detecting faults in the DMOS electro-fluidic interface and the. Design, test, integration and packaging of MEMS/MOEMS, Article in Microsystem Technologies 48(1) September with 10 Reads How we measure 'reads'. Design, test, integration and packaging of MEMS/MOEMS, Article in Microsystem Technologies 13() May with 3 Reads How we measure 'reads'.   Marzencki M, Basrour S, Charlot B, Grasso A, Colin M and Valbin L Design and fabrication of piezoelectric micro power generators for autonomous microsystems Proc. Symp. on Design, Test, Integration and Packaging of MEMS/MOEMS DTIP05 (Montreux, Switzerland) pp Google Scholar.

Search the leading research in optics and photonics applied research from SPIE journals, conference proceedings and presentations, and eBooks. Automatic Calibration of Field Mill Using Virtual Instrument. Authors; C., Xia, S.: Design and modelling of a microsensor for atmospheric electric field measurement. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS , pp. Yuan H., Wang Q., Song X. () Automatic Calibration of Field Mill Using Virtual. A theoretical model is developed to predict the performance of the accelerometer. A set of example design parameters of the device is obtained based on the analysis. Test Conference, Proceedings. ITC International, Vol. 1, pp. Test, Integration and Packaging of MEMS/MOEMS (DTIP), Symposium on, April , , pp. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS , Proceedings of SPIE, Volume pp - 83, Mai , Cannes H. Bolte, O. Nüssen, D. Peters, R. Laur, D. Richter: "Computer aided design of a radiometric system for material sheet production", Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Residual stresses develop due to intrinsic and extrinsic strains that form during the processing. Extrinsic strains can be determined using coefficient of thermal expansion, material properties, and . Therefore, wafer-level packaging technology becomes a key technique to develop, along with wafer-level MEMS release, as has been demonstrated. 1, 2 For radio frequency (RF)-MEMS devices, packaging faces more constraints, due to detuning effects that the packaging materials may have on the performance of the packaged RF device. The development of test standards and understanding the underlying physics of different failure modes has always been of major concern for the RF-MEMS designers. This paper reviews the different failure modes in the RF-MEMS switches like stiction, residual stress, cyclic fatigue, creep, wear and packaging in . A 3D-AFPGA mockup test structure was then proposed for completing development and exercising the 3D integration process flows. This mockup test structure consists of a three-tier demonstration vehicle consisting of a chip-to-wafer and a subsequent chip-to-chip bond. Besides, an alternate copper bonding approach using pillars was explored.